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preliminary this data sheet states amd?s current technical specifications regarding the product described herein. this data sheet may be revised by subsequent versions or modifications due to changes in technical specifications. publication# 23476 rev: b amendment/ +4 issue date: september 4, 2001 refer to amd?s website (www.amd.com) for the latest information. am29bds323d 32 megabit (2 m x 16-bit) cmos 1.8 volt-only simultaneous read/write, burst mode flash memory distinctive characteristics single 1.8 volt read, program and erase (1.7 to 1.9 volt) multiplexed data and address for reduced i/o count ? a0 ? a15 multiplexed as d0 ? d15 ? addresses are latched with avd# control inputs while ce# low simultaneous read/write operation ? data can be continuously read from one bank while executing erase/program functions in other bank ? zero latency between read and write operations read access times at 40 mhz ? burst access times of 20 ns @ 30 pf at industrial temperature range ? asynchronous random access times of 110 ns @ 30 pf ? synchronous random access times of 120 ns @ 30 pf burst length ? continuous linear burst power dissipation (typical values, 8 bits switching, c l = 30 pf) ? burst mode read: 25 ma ? simultaneous operation: 40 ma ? program/erase: 15 ma ? standby mode: 0.2 a sector architecture ? eight 4 kword sectors and sixty-three sectors of 32 kwords each ? bank a contains the eight 4 kword sectors and fifteen 32 kword sectors ? bank b contains forty-eight 32 kword sectors sector protection ? software command sector locking ? wp# protects the last two boot sectors ? all sectors locked when v pp = v il software command set compatible with jedec 42.4 standards ? backwards compatible with am29f and am29lv families minimum 1 million erase cycle guarantee per sector 20-year data retention at 125 c ? reliable operation for the life of the system embedded algorithms ? embedded erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors ? embedded program algorithm automatically writes and verifies data at specified addresses data# polling and toggle bits ? provides a software method of detecting program and erase operation completion erase suspend/resume ? suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation hardware reset input (reset#) ? hardware method to reset the device for reading array data cmos compatible inputs, cmos compatible outputs low v cc write inhibit package option ? 47-ball fbga
2 am29bds323d preliminary general description the am29bds323 is a 32 mbit, 1.8 volt-only, simulta- neous read/write, burst mode flash memory device, organized as 2,097,152 words of 16 bits each. this device uses a single v cc of 1.7 to 1.9 v to read, pro- gram, and erase the memory array. a 12.0-volt v pp may be used for faster program performance if desired. the device can also be programmed in standard eprom programmers. the am29bds323 provides a burst access of 20 ns at 30 pf with initial access times of 120 ns at 30 pf. the device operates within the industrial temperature range of ? 40 c to +85 c. the device is offered in the 47-ball fbga package. simultaneous read/write operations with zero latency the simultaneous read/write architecture provides simultaneous operation by dividing the memory space into two banks. the device can improve overall system performance by allowing a host system to pro- gram or erase in one bank, then immediately and si- multaneously read from the other bank, with zero latency. this releases the system from waiting for the completion of program or erase operations. the device is divided as shown in the following table: the device uses chip enable (ce#), write enable (we#), address valid (avd#) and output enable (oe#) to control asynchronous read and write opera- tions. for burst operations, the device additionally requires power saving (ps), ready (rdy), and clock (clk). this implementation allows easy interface with minimal glue logic to a wide range of microproces- sors/microcontrollers for high performance read opera- tions. the device offers complete compatibility with the jedec 42.4 single-power-supply flash command set standard . commands are written to the command register using standard microprocessor write timings. reading data out of the device is similar to reading from other flash or eprom devices. the host system can detect whether a program or erase operation is complete by using the device sta- tus bit dq7 (data# polling) and dq6/dq2 (toggle bits). after a program or erase cycle has been com- pleted, the device automatically returns to reading array data. the sector erase architecture allows memory sec- tors to be erased and reprogrammed without affecting the data contents of other sectors. the device is fully erased when shipped from the factory. hardware data protection measures include a low v cc detector that automatically inhibits write opera- tions during power transitions. the device also offers three types of data protection at the sector level. the sector lock/unlock command sequence disables or re-enables both program and erase operations in any sector. when at v il , wp# locks the two outermost sec- tors. finally, when v pp is at v il , all sectors are locked. the device offers two power-saving features. when addresses have been stable for a specified amount of time, the device enters the automatic sleep mode . the system can also place the device into the standby mode . power consumption is greatly re- duced in both modes. bank a sectors bank b sectors quantity size quantity size 8 4 kwords 48 32 kwords 15 32 kwords 8 mbits total 24 mbits total
am29bds323d 3 preliminary table of contents product selector guide . . . . . . . . . . . . . . . . . . . . . 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 simultaneous operation circuit block diagram . 5 connection diagram . . . . . . . . . . . . . . . . . . . . . . . . 6 special handling instructions for fbga package .................... 6 input/output descriptions . . . . . . . . . . . . . . . . . . . 7 logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ordering information . . . . . . . . . . . . . . . . . . . . . . . 8 device bus operations . . . . . . . . . . . . . . . . . . . . . . 9 table 1. device bus operations ......................................................9 requirements for asynchronous read operation (non-burst) 9 requirements for synchronous (burst) read operation .......... 9 programmable wait state ...................................................... 10 power saving function ........................................................... 10 simultaneous read/write operations with zero latency ....... 10 writing commands/command sequences ............................ 10 accelerated program operation ......................................................11 autoselect functions .......................................................................11 automatic sleep mode ........................................................... 11 reset#: hardware reset input ............................................. 11 output disable mode .............................................................. 11 hardware data protection ...................................................... 11 low vcc write inhibit .....................................................................12 write pulse ?glitch? protection ........................................................12 logical inhibit ..................................................................................12 table 2. sector address table ........................................................13 command definitions . . . . . . . . . . . . . . . . . . . . . . 15 reading array data ................................................................ 15 set wait state command sequence ...................................... 15 table 3. third cycle address/data .................................................15 enable ps (power saving) mode command sequence ........ 15 sector lock/unlock command sequence .............................. 15 reset command ..................................................................... 15 autoselect command sequence ............................................ 16 program command sequence ............................................... 16 unlock bypass command sequence ..............................................16 figure 1. program operation .......................................................... 17 chip erase command sequence ........................................... 17 sector erase command sequence ........................................ 17 erase suspend/erase resume commands ........................... 18 figure 2. erase operation............................................................... 19 command definitions ............................................................. 20 table 4. command definitions .......................................................20 write operation status . . . . . . . . . . . . . . . . . . . . . 21 dq7: data# polling ................................................................. 21 figure 3. data# polling algorithm ................................................... 21 dq6: toggle bit i .................................................................... 22 figure 4. toggle bit algorithm........................................................ 22 dq2: toggle bit ii ................................................................... 23 table 5. dq6 and dq2 indications ................................................ 23 reading toggle bits dq6/dq2 ............................................... 23 dq5: exceeded timing limits ................................................ 23 dq3: sector erase timer ....................................................... 24 table 6. write operation status ..................................................... 24 absolute maximum ratings . . . . . . . . . . . . . . . . 25 figure 5. maximum negative overshoot waveform ...................... 25 figure 6. maximum positive overshoot waveform........................ 25 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . 25 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26 test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 27 figure 7. test setup....................................................................... 27 table 7. test specifications ........................................................... 27 figure 8. input waveforms and measurement levels ................... 27 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . 28 synchronous/burst read ........................................................ 28 figure 9. burst mode read ............................................................ 28 asynchronous read ............................................................... 29 figure 10. asynchronous mode read............................................ 29 figure 11. reset timings............................................................... 30 erase/program operations ..................................................... 31 figure 12. program operation timings.......................................... 32 figure 13. chip/sector erase operations ...................................... 33 figure 14. accelerated unlock bypass programming timing........ 34 figure 15. data# polling timings (during embedded algorithm) .. 35 figure 16. toggle bit timings (during embedded algorithm)........ 35 figure 17. latency with boundary crossing .................................. 36 figure 18. initial access with power saving (ps) function and address boundary latency ...................................... 37 figure 19. initial access with address boundary latency ............. 37 figure 20. example of five wait states insertion .......................... 38 figure 21. back-to-back read/write cycle timings ...................... 39 erase and programming performance . . . . . . . 40 data retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 physical dimensions* . . . . . . . . . . . . . . . . . . . . . 41 fdd047 ? 47-pin fine-pitch ball grid array (fbga) 7 x 10 mm package ................................................................ 41 revision summary . . . . . . . . . . . . . . . . . . . . . . . . 43 revision a (february 15, 2000) .............................................. 43 revision b (june 20, 2000) .................................................... 43 revision b+1 (november 27, 2000) ....................................... 43 revision b+2 (november 30, 2000) ....................................... 43 revision b+3 (december 21, 2000) ....................................... 43 revision b+4 (september 4, 2001) ........................................ 43
4 am29bds323d preliminary product selector guide block diagram part number am29bds323d synchronous/burst asynchronous speed option 11a (40 mhz) speed option 11a v cc = 1.7 ? 1.9 v max initial access time, ns (t iacc ) 120 max access time, ns (t acc )110 max burst access time, ns (t bacc ) 20 max ce# access, ns (t ce )110 max oe# access, ns (t oe ) 20 max oe# access, ns (t oe )35 input/output buffers x-decoder y-decoder chip enable output enable logic erase voltage generator pgm voltage generator timer v cc detector state control command register v cc v ss we# reset# v pp ce# oe# a/dq0 ? a/dq15 data latch y-gating cell matrix address latch a/dq0 ? a/dq15 a16 ? a20 rdy buffer rdy burst state control burst address counter ps buffer ps avd# clk a0 ? a20
am29bds323d 5 preliminary simultaneous operation circuit block diagram note: a0 ? a15 are multiplexed with dq0 ? dq15. v cc v ss upper bank address a0 ? a20 reset# we# ce# adv# dq0 ? dq15 state control & command register upper bank x-decoder y-decoder latches and control logic oe# dq0 ? dq15 lower bank y-decoder x-decoder latches and control logic lower bank address status control a0 ? a20 a0 ? a20 a0 ? a20 a0 ? a20 dq0 ? dq15 dq0 ? dq15 16/32#
6 am29bds323d preliminary connection diagram special handling instructions for fbga package special handling is required for flash memory products in fbga packages. flash memory devices in fbga packages may be damaged if exposed to ultrasonic cleaning methods. the package and/or data integrity may be compromised if the package body is exposed to temperatures above 150 c for prolonged periods of time. a1 rdy a2 nc a3 gnd a4 clk a5 v cc a6 we# a7 v pp a8 a19 a9 a17 a10 nc b1 v cc b2 a16 b3 a20 b4 avd# b5 ps b6 reset# b7 wp# b8 a18 b9 ce# b10 gnd c1 gnd c2 a/dq7 c3 a/dq6 c4 a/dq13 c5 a/dq12 c6 a/dq3 c7 a/dq2 c8 a/dq9 c9 a/dq8 c10 oe# d1 a/dq15 d2 a/dq14 d3 gnd d4 a/dq5 d5 a/dq4 d6 a/dq11 d7 a/dq10 d8 v cc d9 a/dq1 d10 a/dq0 47-ball fbga top view, balls facing down
am29bds323d 7 preliminary input/output descriptions a16 ? a20 = address inputs a/dq0 ? = multiplexed address/data input/output a/dq15 ce# = chip enable input. asynchronous relative to clk for the burst mode. oe# = output enable input. asynchronous relative to clk for the burst mode. we# = write enable input. v cc = device power supply (1.7 v ? 1.9 v). v ss = ground nc = no connect; not connected internally rdy = ready output; indicates the status of the burst read. low = data not valid at expected time. high = data valid. clk = the first rising edge of clk in conjunction with avd# low latches address input and activates burst mode operation. after the initial word is output, subsequent rising edges of clk increment the internal address counter. clk should remain low during asynchronous access. avd# = address valid input. indicates to device that the valid address is present on the address inputs (address bits a0 ? a15 are multiplexed, address bits a16 ? a20 are address only). low = for asynchronous mode, indicates valid address; for burst mode, causes starting address to be latched on rising edge of clk. high = device ignores address inputs ps = power saving input/output during a read operation, ps indicates whether or not the data on the outputs are inverted. low = data not inverted; high = data inverted reset# = hardware reset input. low = device resets and returns to reading array data. reset# must be low during device power up. wp# = hardware write protect input. low = disables writes to sa70 and sa71 v pp = at 12 v, accelerates programming; automatically places device in unlock bypass mode. at v il , disables program and erase functions. should be at v ih for all other conditions. logic symbol 5 16 a/dq0 ? a/dq15 a16 ? a20 ce# oe# we# reset# clk rdy ps avd#
8 am29bds323d preliminary ordering information the order number (valid combination) is formed by the following: valid combinations valid combination configuration planned to be supported for this device. am29bds323d t 11 a wk i temperature range i = industrial ( ? 40 c to +85 c) package type wk = 47-ball fine-pitch grid array (fbga) 0.50 mm pitch, 7 x 10 mm package (fdd047) clock rate a=40 mhz speed see product selector guide and valid combination boot code sector architecture t = top sector device number/description am29bds323d 32 megabit (2 m x 16-bit) cmos flash memory, simultaneous read/write, burst mode flash memory 1.8 volt-only read, program, and erase valid combinations order number package marking AM29BDS323DT11AWKI n323dt1avi
am29bds323d 9 preliminary device bus operations this section describes the requirements and use of the device bus operations, which are initiated through the internal command register. the command register itself does not occupy any addressable memory location. the register is composed of latches that store the com- mands, along with the address and data information needed to execute the command. the contents of the register serve as inputs to the internal state machine. the state machine outputs dictate the function of the device. table 1 lists the device bus operations, the in- puts and control levels they require, and the resulting output. the following subsections describe each of these operations in further detail. table 1. device bus operations legend: l = logic 0, h = logic 1, x = don ? t care. requirements for asynchronous read operation (non-burst) to read data from the memory array, the system must first assert a valid address on a/dq0 ? a/dq15 and a16 ? a20, while driving avd# and ce# to v il . we# should remain at v ih . note that clk must remain low for asynchronous read operations. the rising edge of avd# latches the address, after which the system can drive oe# to v il . the data will appear on a/dq0 ? a/dq15. since the memory array is divided into two banks, each bank remains enabled for read access until the command register contents are altered. address access time (t acc ) is equal to the delay from stable addresses to valid output data. the chip enable access time (t ce ) is the delay from the stable addresses and stable ce# to valid data at the outputs. the output enable access time (t oe ) is the delay from the falling edge of oe# to valid data at the output. the internal state machine is set for reading array data upon device power-up, or after a hardware reset. this ensures that no spurious alteration of the memory content occurs during the power transition. requirements for synchronous (burst) read operation the device is capable of continuous, sequential (linear) burst operation. however, when the device first powers up, it is enabled for asynchronous read operation. the device will automatically be enabled for burst mode on the first rising edge on the clk input, while avd# is held low for one clock cycle. prior to activating the clock signal, the system should determine how many wait states are desired for the initial word (t iacc ) of each burst session. the system would then write the set wait count command sequence (see ? programmable wait state ? ). the system may optionally activate the ps mode (see ? power saving function ? ) by writing the enable ps mode command sequence at this time, but note that the ps mode can only be disabled by a hard- ware reset. (see ? command definitions ? for further details). the initial word is output t iacc after the rising edge of the first clk cycle. subsequent words are output t bacc operation ce# oe# we# a16?20 a/dq0?15 reset# clk avd# asynchronous read l l h addr in i/o h l write l h l addr in i/o h l standby (ce#) h x x high z high z h x x hardware reset x x x high z high z l x x burst read operations load starting burst address l h h addr in i/o h advance burst to next address with appropriate data presented on the data bus llhhigh z burst data out hh terminate current burst read cycle h x h high z high z h x terminate current burst read cycle via reset# x x h high z high z l x x terminate current burst read cycle and start new burst read cycle l h h high z i/o h
10 am29bds323d preliminary after the rising edge of each successive clock cycle, which automatically increments the internal address counter. note that the device has a fixed internal address boundary that occurs every 64 words, starting at address 00000h . during the time the device is outputting the 64th word (address 0003fh, 0007fh, 000bfh, etc.), a one cycle latency occurs before data appears for the next address (address 00040h, 00080h, 000c0h, etc.). the rdy output indi- cates this condition to the system by pulsing low. see figure 17. the device will continue to output sequential burst data, wrapping around to address 00000h after it reaches the highest addressable memory location, until the system asserts ce# high, reset# low, or avd# low in conjunction with a new address. see table 1. the reset command does not terminate the burst read operation. if the host system crosses the bank boundary while reading in burst mode, and the device is not program- ming or erasing, a one cycle latency will occur as described above. if the host system crosses the bank boundary while the device is programming or erasing, the device will provide asynchronous read status infor- mation. the clock will be ignored. after the host has completed status reads, or the device has completed the program or erase operation, the host can restart a burst operation using a new address and avd# pulse. if the clock frequency is less than 6 mhz during a burst mode operation, additional latencies will occur. rdy indicates the length of the latency by pulsing low. programmable wait state the programmable wait state feature indicates to the device the number of additional clock cycles that must elapse after avd# is driven active before data will be available. upon power up, the device defaults to the maximum of seven total cycles. the total number of wait states is programmable from four to seven cycles. see figure 20. power saving function the power save function reduces the amount of switching on the data output bus by changing the minimum number of bits possible, thereby reducing power consumption. this function is active only during burst mode operations. the device compares the word previously output to the system with the new word to be output. if the number of bits to be switched is 0 ? 8 (less than half the bus width), the device simply outputs the new word on the data bus. if, however, the number of bits that must be switched is 9 or higher, the data is inverted before being output on the data bus. this effectively limits the maximum number of bits that are switched for any given read cycle to eight. the device indicates to the system whether or not the data is inverted via the ps (power saving) output. if the word on the data bus is not inverted, ps = v ol ; if the word on the data bus is inverted, ps = v oh . during initial power up the ps function is disabled. to enable the ps function, the system must write the enable ps command sequence to the flash device (see the command definitions table). when the ps function is enabled, one additional clock cycle is inserted during the initial and second access of a burst sequence. see figure 18. the rdy output indi- cates this condition to the system. the device is also capable of receiving inverted data during program operations. the host system must indi- cate to the device via the ps input whether or not the program data are inverted. ps must be driven to v ih for inverted data, or to v il for non-inverted data. to disable the ps function, the system must hardware reset the device (drive the reset# input low). simultaneous read/write operations with zero latency this device is capable of reading data from one bank of memory while programming or erasing in the other bank of memory. an erase operation may also be sus- pended to read from or program to another location within the same bank (except the sector being erased). figure 21 shows how read and write cycles may be initiated for simultaneous operation with zero latency. refer to the dc characteristics table for read-while-program and read-while-erase current specifications. writing commands/command sequences the device has inputs/outputs that accept both ad- dress and data information. to write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive clk, avd# and ce# to v il , and oe# to v ih when providing an address to the device, and drive clk, we# and ce# to v il , and oe# to v ih . when writing commands or data. the device features an unlock bypass mode to facili- tate faster programming. once a bank enters the unlock bypass mode, only two write cycles are re- quired to program a word, instead of four. an erase operation can erase one sector, multiple sec- tors, or the entire device. table 2 indicates the address space that each sector occupies. the device address space is divided into two banks: bank a contains the boot/parameter sectors, and bank b contains the larger, code sectors of uniform size. a ? bank address ? is the address bits required to uniquely select a bank. similarly, a ? sector address ? is the address bits re- quired to uniquely select a sector.
am29bds323d 11 preliminary i cc2 in the dc characteristics table represents the ac- tive current specification for the write mode. the ac characteristics section contains timing specification tables and timing diagrams for write operations. accelerated program operation the device offers accelerated program operations through v pp . this function is primarily intended to allow faster manufacturing throughput at the factory. if the system asserts v id on this input, the device auto- matically enters the aforementioned unlock bypass mode, temporarily unprotects any protected sectors, and uses the higher voltage on the input to reduce the time required for program operations. the system would use a two-cycle program command sequence as required by the unlock bypass mode. removing v id from the v pp input returns the device to normal op- eration. note that sectors must be unlocked using the sector lock/unlock command sequence prior to rais- ing v pp to v id . autoselect functions if the system writes the autoselect command se- quence, the device enters the autoselect mode. the system can then read autoselect codes from the inter- nal register (which is separate from the memory array) on dq7 ? dq0. standard read cycle timings apply in this mode. refer to the autoselect functions and au- toselect command sequence sections for more information. standby mode when the system is not reading or writing to the de- vice, it can place the device in the standby mode. in this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the oe# input. the device enters the cmos standby mode when the ce# and reset# inputs are both held at v cc 0.2 v. the device requires standard access time (t ce ) for read access when the device is in either of these standby modes, before it is ready to read data. if the device is deselected during erasure or program- ming, the device draws active current until the operation is completed. i cc3 in the dc characteristics table represents the standby current specification. automatic sleep mode the automatic sleep mode minimizes flash device en- ergy consumption. the device automatically enables this mode when addresses remain stable for t acc + 60 ns. the automatic sleep mode is independent of the ce#, we#, and oe# control signals. standard ad- dress access timings provide new data when addresses are changed. while in sleep mode, output data is latched and always available to the system. i cc4 in the dc characteristics table represents the automatic sleep mode current specification. reset#: hardware reset input the reset# input provides a hardware method of re- setting the device to reading array data. when reset# is driven low for at least a period of t rp , the device immediately terminates any operation in progress, tristates all outputs, and ignores all read/write commands for the duration of the reset# pulse. the device also resets the internal state ma- chine to reading array data. the operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to en- sure data integrity. current is reduced for the duration of the reset# pulse. when reset# is held at v ss 0.2 v, the device draws cmos standby current (i cc4 ). if reset# is held at v il but not within v ss 0.2 v, the standby cur- rent will be greater. reset# may be tied to the system reset circuitry. a system reset would thus also reset the flash memory, enabling the system to read the boot-up firmware from the flash memory. note that reset# must be as- serted low during device power-up for proper operation. if reset# is asserted during a program or erase op- eration, the device requires a time of t ready (during embedded algorithms) before the device is ready to read data again. if reset# is asserted when a pro- gram or erase operation is not executing, the reset operation is completed within a time of t ready (not during embedded algorithms). the system can read data t rh after reset# returns to v ih . refer to the ac characteristics tables for reset# pa- rameters and to figure 11 for the timing diagram. output disable mode when the oe# input is at v ih , output from the device is disabled. the outputs are placed in the high impedance state. hardware data protection the command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to table 4 for com- mand definitions). the device offers three types of data protection at the sector level: the sector lock/unlock command sequence dis- ables or re-enables both program and erase opera- tions in any sector.
12 am29bds323d preliminary when wp# is at v il , the two outermost sectors are locked. when v pp is at v il , all sectors are locked. the following hardware data protection measures pre- vent accidental erasure or programming, which might otherwise be caused by spurious system level signals during v cc power-up and power-down transitions, or from system noise. low v cc write inhibit when v cc is less than v lko , the device does not ac- cept any write cycles. this protects data during v cc power-up and power-down. the command register and all internal program/erase circuits are disabled, and the device resets to reading array data. subse- quent writes are ignored until v cc is greater than v lko . the system must provide the proper signals to the control inputs to prevent unintentional writes when v cc is greater than v lko . write pulse ? glitch ? protection noise pulses of less than 5 ns (typical) on oe#, ce# or we# do not initiate a write cycle. logical inhibit write cycles are inhibited by holding any one of oe# = v il , ce# = v ih or we# = v ih . to initiate a write cycle, ce# and we# must be a logical zero while oe# is a logical one.
am29bds323d 13 preliminary table 2. sector address table sector sector size (x16) address range bank b sa0 32 kwords 00000h ? 07fffh sa1 32 kwords 08000h ? 0ffffh sa2 32 kwords 10000h ? 17fffh sa3 32 kwords 18000h ? 1ffffh sa4 32 kwords 20000h ? 27fffh sa5 32 kwords 28000h ? 2ffffh sa6 32 kwords 30000h ? 37fffh sa7 32 kwords 38000h ? 3ffffh sa8 32 kwords 40000h ? 47fffh sa9 32 kwords 48000h ? 4ffffh sa10 32 kwords 50000h ? 57fffh sa11 32 kwords 58000h ? 5ffffh sa12 32 kwords 60000h ? 67fffh sa13 32 kwords 68000h ? 6ffffh sa14 32 kwords 70000h ? 77fffh sa15 32 kwords 78000h ? 7ffffh sa16 32 kwords 80000h ? 87fffh sa17 32 kwords 88000h ? 8ffffh sa18 32 kwords 90000h ? 97fffh sa19 32 kwords 98000h ? 9ffffh sa20 32 kwords a0000h ? a7fffh sa21 32 kwords a8000h ? affffh sa22 32 kwords b0000h ? b7fffh sa23 32 kwords b8000h ? bffffh sa24 32 kwords c0000h ? c7fffh sa25 32 kwords c8000h ? cffffh sa26 32 kwords d0000h ? d7fffh sa27 32 kwords d8000h ? dffffh sa28 32 kwords e0000h ? e7fffh sa29 32 kwords e8000h ? effffh sa30 32 kwords f0000h ? f7fffh sa31 32 kwords f8000h ? fffffh sa32 32 kwords 100000h ? 107fffh sa33 32 kwords 108000h ? 10ffffh sa34 32 kwords 110000h ? 117fffh sa35 32 kwords 118000h ? 11ffffh sa36 32 kwords 120000h ? 127fffh sa37 32 kwords 128000h ? 12ffffh
14 am29bds323d preliminary bank b sa38 32 kwords 130000h ? 137fffh sa39 32 kwords 138000h ? 13ffffh sa40 32 kwords 140000h ? 147fffh sa41 32 kwords 148000h ? 14ffffh sa42 32 kwords 150000h ? 157fffh sa43 32 kwords 158000h ? 15ffffh sa44 32 kwords 160000h ? 167fffh sa45 32 kwords 168000h ? 16ffffh sa46 32 kwords 170000h ? 177fffh sa47 32 kwords 178000h ? 17ffffh bank a sa48 32 kwords 180000h ? 187fffh sa49 32 kwords 188000h ? 18ffffh sa50 32 kwords 190000h ? 197fffh sa51 32 kwords 198000h ? 19ffffh sa52 32 kwords 1a0000h ? 1a7fffh sa53 32 kwords 1a8000h ? 1affffh sa54 32 kwords 1b0000h ? 1b7fffh sa55 32 kwords 1b8000h ? 1bffffh sa56 32 kwords 1c0000h ? 1c7fffh sa57 32 kwords 1c8000h ? 1cffffh sa58 32 kwords 1d0000h ? 1d7fffh sa59 32 kwords 1d8000h ? 1dffffh sa60 32 kwords 1e0000h ? 1e7fffh sa61 32 kwords 1e8000h ? 1effffh sa62 32 kwords 1f0000h ? 1f7fffh sa64 4 kwords 1f8000h ? 1f8fffh sa65 4 kwords 1f9000h ? 1f9fffh sa66 4 kwords 1fa000h ? 1fafffh sa67 4 kwords 1fb000h ? 1fbfffh sa68 4 kwords 1fc000h ? 1fcfffh sa69 4 kwords 1fd000h ? 1fdfffh sa70 4 kwords 1fe000h ? 1fefffh sa71 4 kwords 1ff000h ? 1fffffh table 2. sector address table (continued) sector sector size (x16) address range
am29bds323d 15 preliminary command definitions writing specific address and data commands or sequences into the command register initiates device operations. table 4 defines the valid register command sequences. writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data. all addresses are latched on the rising edge of avd#. all data is latched on the rising edge of we#. refer to the ac characteristics section for timing diagrams. reading array data the device is automatically set to reading array data after device power-up. no commands are required to retrieve data in asynchronous mode. each bank is ready to read array data after completing an embedded program or embedded erase algorithm. after the device accepts an erase suspend command, the corresponding bank enters the erase-sus- pend-read mode, after which the system can read data from any non-erase-suspended sector within the same bank. after completing a programming operation in the erase suspend mode, the system may once again read array data with the same exception. see the erase suspend/erase resume commands section for more information. the system must issue the reset command to return a bank to the read (or erase-suspend-read) mode if dq5 goes high during an active program or erase operation, or if the bank is in the autoselect mode. see the next section, reset command, for more information. see also requirements for asynchronous read operation (non-burst) and requirements for synchronous (burst) read operation in the device bus operations section for more information. the asynchronous read and synchronous/burst read tables provide the read parameters, and figures 9 and 10 show the timings. set wait state command sequence the wait state command sequence instructs the device to set a particular number of clock cycles for the initial access in burst mode. the number of wait states that should be programmed into the device is directly related to the clock frequency. the first two cycles of the command sequence are for unlock purposes. on the third cycle, the system should write c0h to the address associated with the intended wait state setting (see table 3). address bits a12 and a13 determine the setting. table 3. third cycle address/data upon power up, the device defaults to the maximum seven cycle wait state setting (see figure 20). it is rec- ommended that the wait state command sequence be written, even if the default wait state value is desired, to ensure the device is set as expected. a hardware reset will set the wait state to the default setting. enable ps (power saving) mode command sequence the enable ps (power saving) mode command sequence is required to set the device to the ps mode. on power up, the power saving mode is disabled. the command sequence consists of two unlock cycles fol- lowed by a command cycle in which the address and data should 555h/70h, respectively. the ps mode remains enabled until the device is hardware reset (either device is powered down or reset# is asserted low). sector lock/unlock command sequence the sector lock/unlock command sequence allows the system to determine which sectors are protected from accidental writes. when the device is first powered up, all sectors are locked. to unlock a sector, the system must write the sector lock/unlock command sequence. two cycles are first written: addresses are don ? t care and data is 60h. during the third cycle, the sector address (sla) and unlock command (60h) is written, while specifying with address a6 whether that sector should be locked (a6 = v il ) or unlocked (a6 = v ih ). after the third cycle, the system can continue to lock or unlock additional cycles, or exit the sequence by writing f0h (reset command). note that the last two outermost boot sectors can be locked by taking the wp# signal to v il . also, if v pp is at v il all sectors are locked; if the v pp input is at v pp , all sectors are unlocked. reset command writing the reset command resets the banks to the read or erase-suspend-read mode. address bits are don ? t cares for this command. the reset command may be written between the sequence cycles in an erase command sequence before erasing begins. this resets the bank to which address total wait state cycles data 000555h 4 c0h 001555h 5 002555h 6 003555h 7
16 am29bds323d preliminary the system was writing to the read mode. once erasure begins, however, the device ignores reset commands until the operation is complete. the reset command may be written between the sequence cycles in a program command sequence before programming begins. this resets the bank to which the system was writing to the read mode. if the program command sequence is written to a bank that is in the erase suspend mode, writing the reset command returns that bank to the erase-suspend-read mode. once programming begins, however, the device ignores reset commands until the operation is com- plete. the reset command may be written between the sequence cycles in an autoselect command sequence. once in the autoselect mode, the reset command must be written to return to the read mode. if a bank entered the autoselect mode while in the erase suspend mode, writing the reset command returns that bank to the erase-suspend-read mode. if dq5 goes high during a program or erase operation, writing the reset command returns the banks to the read mode (or erase-suspend-read mode if that bank was in erase suspend). autoselect command sequence the autoselect command sequence allows the host system to access the manufacturer and device codes, and determine whether or not a sector is protected. table 4 shows the address and data requirements. the autoselect command sequence may be written to an address within a bank that is either in the read or erase-suspend-read mode. the autoselect command may not be written while the device is actively program- ming or erasing in the other bank. the autoselect command sequence is initiated by first writing two unlock cycles. this is followed by a third write cycle that contains the bank address and the autoselect command. the bank then enters the autoselect mode. the system may read at any address within the same bank any number of times without ini- tiating another autoselect command sequence: a read cycle at address (ba)xx00h (where ba is the bank address) returns the manufacturer code. a read cycle at address (ba)xx01h returns the device code. a read cycle to an address containing a sector ad- dress (sa) within the same bank, and the address 0002h on a15 ? a0 returns 0001h if the sector is locked, or 0000h if it is unlocked. (refer to table 2 for valid sector addresses). the system must write the reset command to return to the read mode (or erase-suspend-read mode if the bank was previously in erase suspend). program command sequence programming is a four-bus-cycle operation. the program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. the program address and data are written next, which in turn initiate the embedded program algorithm. the system is not required to provide further controls or timings. the device automatically provides internally generated program pulses and verifies the programmed cell margin. table 4 shows the address and data requirements for the program command sequence. when the embedded program algorithm is complete, that bank then returns to the read mode and addresses are no longer latched. the system can determine the status of the program operation by monitoring dq7 or dq6/dq2. refer to the write operation status section for information on these status bits. any commands written to the device during the embedded program algorithm are ignored. note that a hardware reset immediately terminates the program operation. the program command sequence should be reinitiated once that bank has returned to the read mode, to ensure data integrity. programming is allowed in any sequence and across sector boundaries. a bit cannot be programmed from ? 0 ? back to a ? 1. ? attempting to do so may cause that bank to set dq5 = 1, or cause the dq7 and dq6 status bit to indicate the operation was suc- cessful. however, a succeeding read will show that the data is still ? 0. ? only erase operations can convert a ? 0 ? to a ? 1. ? unlock bypass command sequence the unlock bypass feature allows the system to program to a bank faster than using the standard program command sequence. the unlock bypass command sequence is initiated by first writing two unlock cycles. this is followed by a third write cycle containing the unlock bypass command, 20h. that bank then enters the unlock bypass mode. a two-cycle unlock bypass program command sequence is all that is required to program in this mode. the first cycle in this sequence contains the unlock bypass program command, a0h; the second cycle contains the program address and data. additional data is programmed in the same manner. this mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in faster total program- ming time. the host system may also initiate the chip erase and sector erase sequences in the unlock bypass mode. the erase command sequences are four cycles in length instead of six cycles. table 4 shows the requirements for the command sequence.
am29bds323d 17 preliminary during the unlock bypass mode, only the unlock bypass program and unlock bypass reset commands are valid. to exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset command sequence. the first cycle must contain the bank address and the data 90h. the second cycle need only contain the data 00h. the bank then returns to the read mode. the device offers accelerated program operations through v pp . when the system asserts v id on this input, the device automatically enters the unlock bypass mode. the system may then write the two-cycle unlock bypass program command sequence. the device uses the higher voltage on the v pp input to accelerate the operation. note that sectors must be unlocked using the sector lock/unlock command sequence prior to raising v pp to v id . figure 1 illustrates the algorithm for the program oper- ation. refer to the erase/program operations table in the ac characteristics section for parameters, and figure 12 for timing diagrams. figure 1. program operation chip erase command sequence chip erase is a six bus cycle operation. the chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the embedded erase algorithm. the device does not require the system to preprogram prior to erase. the embedded erase algo- rithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. the system is not required to provide any con- trols or timings during these operations. the host system may also initiate the chip erase command sequence while the device is in the unlock bypass mode. the command sequence is two cycles cycles in length instead of six cycles. table 4 shows the address and data requirements for the chip erase command sequence. when the embedded erase algorithm is complete, that bank returns to the read mode and addresses are no longer latched. the system can determine the sta- tus of the erase operation by using dq7 or dq6/dq2. refer to the write operation status section for infor- mation on these status bits. any commands written during the chip erase operation are ignored. however, note that a hardware reset immediately terminates the erase operation. if that occurs, the chip erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. figure 2 illustrates the algorithm for the erase opera- tion. refer to the erase/program operations table in the ac characteristics section for parameters, and figure 13 section for timing diagrams. sector erase command sequence sector erase is a six bus cycle operation. the sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. two additional unlock cycles are written, and are then fol- lowed by the address of the sector to be erased, and the sector erase command. table 4 shows the address and data requirements for the sector erase command sequence. the device does not require the system to preprogram prior to erase. the embedded erase algorithm auto- matically programs and verifies the entire memory for an all zero data pattern prior to electrical erase. the system is not required to provide any controls or timings during these operations. after the command sequence is written, a sector erase time-out of no less than 50 s occurs. during the time-out period, additional sector addresses and sector erase commands may be written. loading the sector start write program command sequence data poll from system verify data? no yes last address? no yes programming completed increment address embedded program algorithm in progress note: see table 4 for program command sequence.
18 am29bds323d preliminary erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sec- tors. the time between these additional cycles must be less than 50 s, otherwise erasure may begin. any sector erase address and command following the exceeded time-out may or may not be accepted. it is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. the interrupts can be re-enabled after the last sector erase command is written. any command other than sector erase or erase suspend during the time-out period resets that bank to the read mode. the system must rewrite the command sequence and any additional addresses and commands. the system can monitor dq3 to determine if the sec- tor erase timer has timed out (see the section on dq3: sector erase timer.). the time-out begins from the ris- ing edge of the final we# pulse in the command sequence. when the embedded erase algorithm is complete, the bank returns to reading array data and addresses are no longer latched. note that while the embedded erase operation is in progress, the system can read data from the non-erasing bank. the system can determine the status of the erase oper- ation by reading dq7 or dq6/ dq2 in the erasing bank. note that the host system must wait 200 s after the last sector erase command to obtain status information if the first status read is in a different bank than the last sector selected for erasure. for example, if sector 0, which is in bank b, was the last sector selected for era- sure, and the host system requests its first status read from sector 71, which is in bank a, then the device requires 200 s before status information will be avail- able. refer to the write operation status section for information on these status bits. once the sector erase operation has begun, only the erase suspend command is valid. all other commands are ignored. however, note that a hardware reset immediately terminates the erase operation. if that occurs, the sector erase command sequence should be reinitiated once that bank has returned to reading array data, to ensure data integrity. the host system may also initiate the sector erase command sequence while the device is in the unlock bypass mode. the command sequence is four cycles cycles in length instead of six cycles. figure 2 illustrates the algorithm for the erase opera- tion. refer to the erase/program operations table in the ac characteristics section for parameters, and figure 13 section for timing diagrams. erase suspend/erase resume commands the erase suspend command, b0h, allows the sys- tem to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. the bank address is required when writing this command. this command is valid only during the sector erase operation, including the minimum 50 s time-out period during the sector erase command se- quence. the erase suspend command is ignored if written during the chip erase operation or embedded program algorithm. when the erase suspend command is written during the sector erase operation, the device requires a maximum of 20 s to suspend the erase operation. however, when the erase suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and sus- pends the erase operation. after the erase operation has been suspended, the bank enters the erase-suspend-read mode. the system can read data from or program data to any sector not selected for erasure. (the device ? erase suspends ? all sectors selected for erasure.) reading at any address within erase-suspended sectors produces status information on dq7 ? dq0. the system can use dq7, or dq6 and dq2 together, to determine if a sector is actively erasing or is erase-suspended. refer to the write operation status section for information on these status bits. after an erase-suspended program operation is com- plete, the bank returns to the erase-suspend-read mode. the system can determine the status of the program operation using the dq7 or dq6 status bits, just as in the standard program operation. refer to the write operation status section for more information. in the erase-suspend-read mode, the system can also issue the autoselect command sequence. refer to the autoselect functions and autoselect command sequence sections for details. to resume the sector erase operation, the system must write the erase resume command. the bank address of the erase-suspended bank is required when writing this command. further writes of the resume command are ignored. another erase suspend command can be written after the chip has resumed erasing.
am29bds323d 19 preliminary figure 2. erase operation start write erase command sequence data poll from system data = ffh? no yes erasure completed embedded erase algorithm in progress notes: 1. see table 4 for erase command sequence. 2. see the section on dq3 for information on the sector erase timer.
20 am29bds323d preliminary command definitions table 4. command definitions legend: x = don ? t care ra = address of the memory location to be read. rd = data read from location ra during read operation. pa = address of the memory location to be programmed. addresses latch on the falling edge of the we# or ce# pulse, whichever happens later. pd = data to be programmed at location pa. data latches on the rising edge of we# or ce# pulse, whichever happens first. sa = address of the sector to be verified (in autoselect mode) or erased. address bits a20 ? a12 uniquely select any sector. ba = address of the bank (a20, a19) that is being switched to autoselect mode, is in bypass mode, or is being erased. sla = address of the sector to be locked. set sector address (sa) and either a6 = 1 for unlocked or a6 = 0 for locked. ws = number of wait states defined by a12, a13. notes: 1. see table 1 for description of bus operations. 2. all values are in hexadecimal. 3. except for the read cycle and the fourth cycle of the autoselect command sequence, all bus cycles are write cycles. 4. data bits dq15 ? dq8 are don ? t care in command sequences, except for rd and pd. 5. unless otherwise noted, address bits a20 ? a11 are don ? t cares. 6. no unlock or command cycles required when bank is reading array data. 7. the reset command is required to return to reading array data (or to the erase-suspend-read mode if previously in erase suspend) when a bank is in the autoselect mode, or if dq5 goes high (while the bank is providing status information). 8. the fourth cycle of the autoselect command sequence is a read cycle. the system must provide the bank address. see the autoselect command sequence section for more information. 9. the fifth cycle of the device id autoselect command sequence is an extended device id code. the data is 00h for devices that do not require additional latency when burst address begins at an address boundary, and 20h for devices that require additional latency when burst address begins at an address boundary. 10. the data is 0000h for an unlocked sector and 0001h for a locked sector. all sectors are again locked upon hardware reset. 11. the unlock bypass command is required prior to this command sequence. 12. the unlock bypass reset command is required to return to reading array data when the bank is in the unlock bypass mode. 13. the system may read and program in non-erasing sectors, or enter the autoselect mode, when in the erase suspend mode. the erase suspend command is valid only during a sector erase operation, and requires the bank address. 14. the erase resume command is valid only during the erase suspend mode, and requires the bank address. 15. the addresses in the third cycle must contain, on a12 and a13, the additional wait counts to be set. see ? set wait state command sequence ? . command sequence (note 1) cycles bus cycles (notes 2 ? 5) first second third fourth fifth sixth addr data addr data addr data addr data addr data addr data asynchronous read (note 6) 1 ra rd reset (note 7) 1 xxx f0 autoselect (note 8) manufacturer id 4 555 aa 2aa 55 (ba)555 90 (ba)x00 0001 device id (note 9) 4 555 aa 2aa 55 (ba)555 90 (ba)x01 22d1 (ba)x03 20/00 sector lock verify (note 10) 4 555 aa 2aa 55 (sa)555 90 (sa)x02 00/01 program 4 555 aa 2aa 55 555 a0 pa data unlock bypass 3 555 aa 2aa 55 555 20 unlock bypass program (note 11) 2 xxx a0 pa pd unlock bypass sector erase (note 11) 2 xxx 80 sa 30 unlock bypass chip erase (note 11) 2 xxx 80 xxx 10 unlock bypass reset (note 12) 2 ba 90 xxx 00 chip erase 6 555 aa 2aa 55 555 80 555 aa 2aa 55 555 10 sector erase 6 555 aa 2aa 55 555 80 555 aa 2aa 55 sa 30 erase suspend (note 13) 1 ba b0 erase resume (note 14) 1 ba 30 sector lock/unlock 3 xxx 60 xxx 60 sla 60 set wait count (note 15) 3 555 aa 2aa 55 (ws)555 c0 enable ps mode 3 555 aa 2aa 55 555 70
am29bds323d 21 preliminary write operation status the device provides several bits to determine the status of a program or erase operation: dq2, dq3, dq5, dq6, and dq7. table 6 and the following subsections describe the function of these bits. dq7 and dq6 each offer a method for determining whether a program or erase operation is complete or in progress. dq7: data# polling the data# polling bit, dq7, indicates to the host system whether an embedded program or erase algo- rithm is in progress or completed, or whether a bank is in erase suspend. data# polling is valid after the rising edge of the final we# pulse in the command sequence. during the embedded program algorithm, the device outputs on dq7 the complement of the datum pro- grammed to dq7. this dq7 status also applies to pro- gramming during erase suspend. when the embedded program algorithm is complete, the device outputs the datum programmed to dq7. the system must provide the program address to read valid status information on dq7. if a program address falls within a protected sector, data# polling on dq7 is active for approximately 1 s, then that bank returns to the read mode. during the embedded erase algorithm, data# polling produces a ? 0 ? on dq7. when the embedded erase algorithm is complete, or if the bank enters the erase suspend mode, data# polling produces a ? 1 ? on dq7. the system must provide an address within any of the sectors selected for erasure to read valid status infor- mation on dq7. note that the host system must wait 200 s after the last sector erase command to obtain status information if the first status read is in a different bank than the last sector selected for erasure. for example, if sector 0, which is in bank b, was the last sector selected for erasure, and the host system requests its first status read from sector 71, which is in bank a, then the device requires 200 s before status information will be available. after an erase command sequence is written, if all sectors selected for erasing are protected, data# polling on dq7 is active for approximately 100 s, then the bank returns to the read mode. if not all selected sectors are protected, the embedded erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. however, if the system reads dq7 at an address within a protected sector, the status may not be valid. just prior to the completion of an embedded program or erase operation, dq7 may change asynchronously with dq0 ? dq6 while output enable (oe#) is asserted low. that is, the device may change from providing status information to valid data on dq7. depending on when the system samples the dq7 output, it may read the status or valid data. even if the device has com- pleted the program or erase operation and dq7 has valid data, the data outputs on dq0 ? dq6 may be still invalid. valid data on dq0 ? dq7 will appear on succes- sive read cycles. table 6 shows the outputs for data# polling on dq7. figure 3 shows the data# polling algorithm. figure 15 in the ac characteristics section shows the data# polling timing diagram. figure 3. data# polling algorithm dq7 = data? yes no no dq5 = 1? no yes yes fail pass read dq7 ? dq0 addr = va read dq7 ? dq0 addr = va dq7 = data? start notes: 1. va = valid address for programming. during a sector erase operation, a valid address is any sector address within the sector being erased. during chip erase, a valid address is any non-protected sector address. 2. dq7 should be rechecked even if dq5 = ? 1 ? because dq7 may change simultaneously with dq5.
22 am29bds323d preliminary rdy: ready the rdy is a dedicated output that indicates (when at logic low) the system should wait 1 clock cycle before expecting the next word of data. rdy functions only while reading data in burst mode. three conditions may cause the rdy output to be low: during the initial access (in burst mode) when ps is enabled; after the boundary that occurs every 64 words beginning at address 00000h; and when the clock fre- quency is less than 6 mhz (in which case rdy is low every third clock). dq6: toggle bit i toggle bit i on dq6 indicates whether an embedded program or erase algorithm is in progress or complete, or whether the device has entered the erase suspend mode. toggle bit i may be read at any address in the same bank, and is valid after the rising edge of the final we# pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out. during an embedded program or erase algorithm operation, successive read cycles to any address cause dq6 to toggle. note that oe# must be low during toggle bit status reads. when the operation is com- plete, dq6 stops toggling. after an erase command sequence is written, if all sectors selected for erasing are protected, dq6 toggles for approximately 100 s, then returns to reading array data. if not all selected sectors are pro- tected, the embedded erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. note that the host system must wait 200 s after the last sector erase command to obtain status information if the first status read is in a different bank than the last sector selected for erasure. for example, if sector 0, which is in bank b, was the last sector selected for era- sure, and the host system requests its first status read from sector 71, which is in bank a, then the device requires 200 s before status information will be avail- able. the system can use dq6 and dq2 together to deter- mine whether a sector is actively erasing or is erase-suspended. when the device is actively erasing (that is, the embedded erase algorithm is in progress), dq6 toggles. when the device enters the erase suspend mode, dq6 stops toggling. however, the system must also use dq2 to determine which sectors are erasing or erase-suspended. alternatively, the system can use dq7 (see the subsection on dq7: data# polling). if a program address falls within a protected sector, dq6 toggles for approximately 1 s after the program command sequence is written, then returns to reading array data. dq6 also toggles during the erase-suspend-program mode, and stops toggling once the embedded program algorithm is complete. see the following for additional information: figure 4 (toggle bit flowchart), dq6: toggle bit i (description), figure 16 (toggle bit timing diagram), and table 5 (compares dq2 and dq6). figure 4. toggle bit algorithm start no yes yes dq5 = 1? no yes dq6 = toggle? no read byte (dq0-dq7) address = va dq6 = toggle? read byte twice (dq 0-dq7) adrdess = va read byte (dq0-dq7) address = va fail pass note: the system should recheck the toggle bit even if dq5 = ? 1 ? because the toggle bit may stop toggling as dq5 changes to ? 1. ? see the subsections on dq6 and dq2 for more information.
am29bds323d 23 preliminary dq2: toggle bit ii the ? toggle bit ii ? on dq2, when used with dq6, indi- cates whether a particular sector is actively erasing (that is, the embedded erase algorithm is in progress), or whether that sector is erase-suspended. toggle bit ii is valid after the rising edge of the final we# pulse in the command sequence. dq2 toggles when the system reads at addresses within those sectors that have been selected for era- sure. note that oe# must be low during toggle bit status reads. but dq2 cannot distinguish whether the sector is actively erasing or is erase-suspended. dq6, by comparison, indicates whether the device is actively erasing, or is in erase suspend, but cannot distinguish which sectors are selected for erasure. thus, both status bits are required for sector and mode informa- tion. refer to table 6 to compare outputs for dq2 and dq6. see the following for additional information: figure 4 (toggle bit flowchart), dq6: toggle bit i (description), figure 16 (toggle bit timing diagram), and table 5 (compares dq2 and dq6). table 5. dq6 and dq2 indications reading toggle bits dq6/dq2 refer to figure 4 for the following discussion. when- ever the system initially begins reading toggle bit status, it must read dq7 ? dq0 at least twice in a row to determine whether a toggle bit is toggling. typically, the system would note and store the value of the toggle bit after the first read. after the second read, the system would compare the new value of the toggle bit with the first. if the toggle bit is not toggling, the device has com- pleted the program or erase operation. the system can read array data on dq7 ? dq0 on the following read cycle. however, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of dq5 is high (see the section on dq5). if it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped tog- gling just as dq5 went high. if the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. if it is still toggling, the device did not completed the operation successfully, and the system must write the reset command to return to reading array data. the remaining scenario is that the system initially determines that the toggle bit is toggling and dq5 has not gone high. the system may continue to monitor the toggle bit and dq5 through successive read cycles, determining the status as described in the previous paragraph. alternatively, it may choose to perform other system tasks. in this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of figure 4). dq5: exceeded timing limits dq5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. under these conditions dq5 produces a ? 1, ? indicating that the program or erase cycle was not successfully completed. the device may output a ? 1 ? on dq5 if the system tries to program a ? 1 ? to a location that was previously pro- grammed to ? 0. ? only an erase operation can change a ? 0 ? back to a ? 1. ? under this condition, the if device is and the system reads then dq6 and dq2 programming, at any address, toggles, does not toggle. actively erasing, at an address within a sector selected for erasure, toggles, also toggles. at an address within sectors not selected for erasure, toggles, does not toggle. erase suspended, at an address within a sector selected for erasure, does not toggle, toggles. at an address within sectors not selected for erasure, returns array data, returns array data. the system can read from any sector not selected for erasure. programming in erase suspend at any address, toggles, is not applicable.
24 am29bds323d preliminary device halts the operation, and when the timing limit has been exceeded, dq5 produces a ? 1. ? under both these conditions, the system must write the reset command to return to the read mode (or to the erase-suspend-read mode if a bank was previ- ously in the erase-suspend-program mode). dq3: sector erase timer after writing a sector erase command sequence, the system may read dq3 to determine whether or not erasure has begun. (the sector erase timer does not apply to the chip erase command.) if additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. when the time-out period is complete, dq3 switches from a ? 0 ? to a ? 1. ? if the time between additional sector erase commands from the system can be assumed to be less than 50 s, the system need not monitor dq3. see also the sector erase command sequence sec- tion. after the sector erase command is written, the system should read the status of dq7 (data# polling) or dq6 (toggle bit i) to ensure that the device has accepted the command sequence, and then read dq3. if dq3 is ? 1, ? the embedded erase algorithm has begun; all further commands (except erase suspend) are ignored until the erase operation is complete. if dq3 is ? 0, ? the device will accept additional sector erase commands. to ensure the command has been accepted, the system software should check the status of dq3 prior to and following each subsequent sector erase com- mand. if dq3 is high on the second status check, the last command might not have been accepted. table 6 shows the status of dq3 relative to the other status bits. table 6. write operation status notes: 1. dq5 switches to ? 1 ? when an embedded program or embedded erase operation has exceeded the maximum timing limits. refer to the section on dq5 for more information. 2. dq7 and dq2 require a valid address when reading status information. refer to the appropriate subsection for further details. 3. when reading write operation status bits, the system must always provide the bank address where the embedded algorithm is in progress. the device outputs array data if the system addresses a non-busy bank. 4. the system may read either asynchronously or synchronously (burst) while in erase suspend. rdy will function exactly as in non-erase-suspended mode. status dq7 (note 2) dq6 dq5 (note 1) dq3 dq2 (note 2) standard mode embedded program algorithm dq7# toggle 0 n/a no toggle embedded erase algorithm 0 toggle 0 1 toggle erase suspend mode erase-suspend- read (note 4) erase suspended sector 1 no toggle 0 n/a toggle non-erase suspended sector data data data data data erase-suspend-program dq7# toggle 0 n/a n/a
am29bds323d 25 preliminary absolute maximum ratings storage temperature plastic packages . . . . . . . . . . . . . . . ? 65 c to +150 c ambient temperature with power applied . . . . . . . . . . . . . ? 65 c to +125 c voltage with respect to ground, all i/os except v pp (note 1). . . ? 0.5 v to v cc + 0.5 v v cc (note 1) . . . . . . . . . . . . . . . . . . ? 0.5 v to +2.5 v v pp (note 2) . . . . . . . . . . . . . . . . . ? 0.5 v to +12.5 v output short circuit current (note 3) . . . . . . 100 ma notes: 1. minimum dc voltage on input or i/os is ? 0.5 v. during voltage transitions, input at i/os may undershoot v ss to ? 2.0 v for periods of up to 20 ns during voltage transitions inputs might overshooot to v cc +0.5 v for periods up to 20 ns. see figure 5. maximum dc voltage on output and i/os is v cc + 0.5 v. during voltage transitions outputs may overshoot to v cc + 2.0 v for periods up to 20 ns. see figure 6. 2. minimum dc input voltage on v pp is ? 0.5 v. during voltage transitions, v pp may overshoot v ss to ? 2.0 v for periods of up to 20 ns. see figure 5. maximum dc input voltage on v pp is +12.5 v which may overshoot to +13.5 v for periods up to 20 ns. 3. no more than one output may be shorted to ground at a time. duration of the short circuit should not be greater than one second. 4. stresses above those listed under ? absolute maximum ratings ? may cause permanent damage to the device. this is a stress rating only; functional operation of the de- vice at these or any other conditions above those indi- cated in the operational sections of this data sheet is not implied. exposure of the device to absolute maximum rat- ing conditions for extended periods may affect device reli- ability. operating ranges commercial (c) devices ambient temperature (t a ) . . . . . . . . . . . 0 c to +70 c industrial (i) devices ambient temperature (t a ) . . . . . . . . . ? 40 c to +85 c v cc supply voltages v cc supply voltages . . . . . . . . . . . . .+1.7 v to +1.9 v operating ranges define those limits between which the func- tionality of the device is guaranteed. 20 ns 20 ns +0.8 v ? 0.5 v 20 ns ? 2.0 v figure 5. maximum negative overshoot waveform 20 ns 20 ns v cc +2.0 v v cc +0.5 v 20 ns 1.0 v figure 6. maximum positive overshoot waveform
26 am29bds323d preliminary dc characteristics cmos compatible note: 1. maximum i cc specifications are tested with v cc = v cc max. 2. when oe# = v ih , burst mode is deactivated. if oe# = v il is reasserted, the last data prior to oe# = v ih will remain available from the device. a new burst read sequence is initiated when new address is asserted, avd# = v il and oe# = v ih . 3. the i cc current listed is typically less than 2 ma/mhz, with oe# at v ih . 4. i cc active while embedded erase or embedded program is in progress. 5. device enters automatic sleep mode when addresses are stable for t acc + 60 ns. typical sleep mode current is equal to i cc3 . 6. total current during accelerated programming is the sum of v pp and v cc currents. parameter description test conditions (note 1) min typ max unit i li input load current v in = v ss to v cc , v cc = v cc max 1 a i lo output leakage current v out = v ss to v cc , v cc = v cc max 1 a i ccb1 v cc active burst read current ce# = v il , oe# = v il 25 30 ma i ccb2 ce# = v il , oe# = v ih (note 2) 0.5 1 ma i cc1 v cc active asynchronous read current (note 3) ce# = v il , oe# = v ih 5 mhz 10 16 ma 1 mhz 2 4 ma i cc2 v cc active write current (note 4) ce# = v il , oe# = v ih , v pp = v ih 15 40 ma i cc3 v cc standby current (note 5) ce# = v ih , reset# = v ih 0.2 10 a i cc4 v cc reset current reset# = v il, clk = v il 0.2 10 a i cc5 v cc active current (read while write) ce# = v il , oe# = v il 40 60 ma i pp accelerated program current (note 6) ce# = v il , oe# = v ih, v pp = 12.0 0.5 v v pp 715ma v cc 510ma v il input low voltage ? 0.5 0.2 v v ih input high voltage v cc ? 0.2 v cc + 0.2 v v ol output low voltage i ol = 100 a, v cc = v cc min 0.1 v v oh output high voltage i oh = ? 100 a, v cc = v cc min v cc ? 0.1 v v id voltage for accelerated program 11.5 12.5 v v lko low v cc lock-out voltage 1.0 1.4 v
am29bds323d 27 preliminary test conditions table 7. test specifications key to switching waveforms c l device under te s t figure 7. test setup test condition 11a unit output load capacitance, c l (including jig capacitance) 30 pf input rise and fall times 5 ns input pulse levels 0.0 ? v cc v input timing measurement reference levels v cc /2 v output timing measurement reference levels v cc /2 v waveform inputs outputs steady changing from h to l changing from l to h don ? t care, any change permitted changing, state unknown does not apply center line is high impedance state (high z) v cc 0.0 v output measurement level input v cc /2 v cc /2 figure 8. input waveforms and measurement levels
28 am29bds323d preliminary ac characteristics synchronous/burst read notes: 1. figure shows total number of wait states set to five cycles. the total number of wait states can be programmed from four cycles to seven cycles. 2. figure shows that ps (power saving mode) has been enabled; one additional wait state occurs during initial data da. latency is not present if ps is not enabled. 3. if any burst address occurs at a 64-word boundary, one additional clock cycle is inserted, and is indicated by rdy. figure 9. burst mode read parameter description 11a (40 mhz) unit jedec standard t iacc initial access time max 120 ns t bacc burst access time valid clock to output delay max 20 ns t avds avd# setup time to clk min 5 ns t avdh avd# hold time from clk min 7 ns t avdo avd# high to oe# low min 0 ns t acs address setup time to clk min 5 ns t ach address hold time from clk min 7 ns t bdh data hold time from next clock cycle max 4 ns t oe output enable to output valid max 20 ns t cez chip enable to high z max 10 ns t oez output enable to high z max 10 ns t ces ce# setup time to clk min 5 ns t ceh ce# hold time from clk min 7 ns t rdys rdy setup time to clk min 5 ns t racc ready access time from clk max 20 ns da da + 1 da + 2 da + n oe# a/dq0: a/dq15 a16: a20 aa avd# rdy clk ce# t ces t acs t avds t avdh t ach t bacc t oe t oez t cez t iacc t bdh aa 5 cycles for initial access shown. programmable wait state function is set to 01h. 1 cycle wait state when ps enabled 25 ns typ. t racc hi-z hi-z hi-z
am29bds323d 29 preliminary ac characteristics asynchronous read note: not 100% tested. note: ra = read address, rd = read data. figure 10. asynchronous mode read parameter description 11a unit jedec standard t ce access time from ce# low max 110 ns t acc asynchronous access time max 110 ns t avdp avd# low time min 12 ns t aavds address setup time to falling edge of avd min 5 ns t aavdh address hold time from rising edge of avd min 7 ns t oe output enable to output valid max 35 ns t oeh output enable hold time read min 0 ns toggle and data# polling min 10 ns t oez output enable to high z (see note) max 20 ns t ce we# a16 - a21 ce# oe# valid rd t acc t oeh t oe a/dq0: a/dq15 t oez t aavdh t avdp t aavds avd# ra ra
30 am29bds323d preliminary ac characteristics hardware reset (reset#) note: not 100% tested. parameter description all speed options unit jedec std t ready reset# pin low (during embedded algorithms) to read mode (see note) max 20 s t ready reset# pin low (not during embedded algorithms) to read mode (see note) max 500 ns t rp reset# pulse width min 500 ns t rh reset high time before read (see note) min 200 ns t rpd reset# low to standby mode min 20 s reset# t rp t ready reset timings not during embedded algorithms t ready ce#, oe# t rh ce#, oe# reset timings during embedded algorithms reset# t rp figure 11. reset timings
am29bds323d 31 preliminary ac characteristics erase/program operations notes: 1. not 100% tested. 2. see the ? erase and programming performance ? section for more information. 3. does not include the preprogramming time. parameter description 11a unit jedec standard t avav t wc write cycle time (note 1) min 100 ns t avwl t as address setup time min 5 ns t wlax t ah address hold time min 7 ns t avdp avd# low time min 12 ns t dvwh t ds data setup time min 50 ns t whdx t dh data hold time min 0 ns t ghwl t ghwl read recovery time before write typ 0 ns t elwl t cs ce# setup time typ 0 ns t wheh t ch ce# hold time typ 0 ns t wlwh t wp /t wrl write pulse width typ 60 ns t whwl t wph write pulse width high typ 30 ns t sr/w latency between read and write operations min 0 ns t whwh1 t whwh1 programming operation (note 2) typ 11.5 s t whwh1 t whwh1 accelerated programming operation (note 2) typ 4 s t whwh2 t whwh2 sector erase operation (notes 2, 3) typ 1.5 sec t vpp v pp rise and fall time min 500 ns t vps v pp setup time (during accelerated programming) min 1 s t vcs v cc setup time min 50 s
32 am29bds323d preliminary ac characteristics notes: 1. pa = program address, pd = program data, va = valid address for reading status bits. 2. ? in progress ? and ? complete ? refer to status of program operation. 3. a16 ? a20 are don ? t care during command sequence unlock cycles. figure 12. program operation timings oe# ce# a/dq0: a/dq15 a16:a20 avd we# clk v cc 555h a0h pd t as t wp t ah t wc t wph pa pa t vcs t cs t dh t ch in progress t whwh1 va va complete va va program command sequence (last two cycles) read status data ps in ps t ds v ih v il t avdp valid only when ps mode is enabled
am29bds323d 33 preliminary ac characteristics notes: 1. sa is the sector address for sector erase. 2. address bits a16 ? a20 are don ? t cares during unlock cycles in the command sequence. figure 13. chip/sector erase operations oe# ce# a/dq0: a/dq15 a16:a20 avd we# clk v cc 2aah 55h 30h t as t wp t ah t wc t wph sa sa t vcs t cs t dh t ch in progress t whwh2 va va complete va va erase command sequence (last two cycles) read status data t ds 10h for chip erase 555h for chip erase v ih v il t avdp
34 am29bds323d preliminary ac characteristics notes: 1. v pp can be left high for subsequent programming pulses. 2. use setup and hold times from conventional program operation. 3. sectors must be unlocked using the sector lock/unlock command sequence prior to raising v pp to v id . figure 14. accelerated unlock bypass programming timing ce# avd# we# a16:a20 a/dq0: a/dq15 ce# v pp don't care don't care a0h pa pa pd v pp 1 s v il or v ih t vpp t vps
am29bds323d 35 preliminary ac characteristics notes: 1. all status reads are asynchronous. 2. va = valid address. two read cycles are required to determine status. when the embedded algorithm operation is complete, and data# polling will output true data. figure 15. data# polling timings (during embedded algorithm) notes: 1. all status reads are asynchronous. 2. va = valid address. two read cycles are required to determine status. when the embedded algorithm operation is complete, the toggle bits will stop toggling. figure 16. toggle bit timings (during embedded algorithm) we# ce# oe# t oe a16:a20 a/dq0: a/dq15 avd t oeh t ce t ch t oez t cez status data status data t acc va va va va we# ce# oe# t oe a16:a21 a/dq0: a/dq15 avd t oeh t ce t ch t oez t cez status data status data t acc va va va va
36 am29bds323d preliminary ac characteristics notes: 1. cxx indicates the clock that triggers dxx on the outputs; for example, c61 triggers d61. 2. if ps is enabled, rdy will be low for an additional cycle prior to the boundary crossing latency. figure 17. latency with boundary crossing clk address (hex) c61 c62 c63 c64 c64 c65 c66 c67 c68 c69 d61 d62 d63 d64 d65 d66 d67 d68 d69 (stays high) avd# rdy a/dq0: a/dq15 oe#, ce# (stays low) address boundary occurs every 64 words, beginning at address 000000h: 00003fh, 00007fh, 0000bfh, etc.) 3c 3d 3e 3f 3f 40 41 42 43 44 latency t racc
am29bds323d 37 preliminary ac characteristics figure 18. initial access with power saving (ps) function and address boundary latency figure 19. initial access with address boundary latency clk avd# high-z high-z high-z rdy high-z a/dq0: a/dq15 ps oe# ps1 ps2 device is programmable from 4 to 7 total cycles during initial access (here, programmable wait state function is set to 02h; 6 cycles total) ps high if data is inverted, low if data is not inverted 1 additional wait state if address is at boundary 1 additional wait state to indicate ps is enabled avd# low with clock present enables burst read mode address a16:a21 ps boundary latency address d1 d2 d0 clk avd# high-z high-z rdy high-z a/dq0: a/dq15 oe# device is programmable from 4 to 7 total cycles during initial access (here, programmable wait state function is set to 02h; 6 cycles total) 1 additional wait state if address is at boundary avd# low with clock present enables burst read mode address a16:a21 boundary latency address d1 d2 d0
38 am29bds323d preliminary ac characteristics wait state decoding addresses: a13, a12 = ? 11 ? ? 3 programmed, 7 total a13, a12 = ? 10 ? ? 2 programmed, 6 total a13, a12 = ? 01 ? ? 1 programmed, 5 total a13, a12 = ? 00 ? ? 0 programmed, 4 total note: figure assumes that ps is not enabled, and address d0 is not at an address boundary. figure 20. example of five wait states insertion a/dq0: a/dq15 avd# oe# clk 12345 d0 d1 01 6 2 7 3 total number of clock cycles following avd# falling edge rising edge of next clock cycle following last wait state triggers next burst data number of clock cycles pro g rammed
am29bds323d 39 preliminary ac characteristics note: breakpoints in waveforms indicate that system may alternately read array data from the ? non-busy bank ? while checking the status of the program or erase operation in the ? busy ? bank. the system should read status twice to ensure valid information. figure 21. back-to-back read/write cycle timings oe# ce# we# t oh a/dq0: a/dq15 a16: a20 avd# pd/30h pa/sa aah 555h ra pa/sa t wc t ds t dh t rc t rc t oe t as t ah t acc t oeh t wp t ghwl t df t wc t sr/w last cycle in program or sector erase command sequence read status (at least two cycles) in same bank and/or array data from other bank begin another write or program command sequence rd ra ra ra rd t wph
40 am29bds323d preliminary erase and programming performance notes: 1. typical program and erase times assume the following conditions: 25 c, 1.8 v v cc , 1 million cycles. additionally, programming typicals assume checkerboard pattern. 2. under worst case conditions of 90 c, v cc = 1.8 v, 100,000 cycles. 3. the typical chip programming time is considerably less than the maximum chip programming time listed. 4. in the pre-programming step of the embedded erase algorithm, all words are programmed to 00h before erasure. 5. system-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. see table 4 for further information on command definitions. 6. the device has a minimum erase and program cycle endurance of 1 million cycles. data retention parameter typ (note 1) max (note 2) unit comments sector erase time 32 kword 1.5 15 s excludes 00h programming prior to erasure (note 4) 4 kword 0.3 5 chip erase time 97 s word programming time 11.5 360 s excludes system level overhead (note 5) accelerated word programming time 4 210 s chip programming time (note 3) 24 72 s excludes system level overhead (note 5) accelerated chip programming time 8 24 s parameter test conditions min unit minimum pattern data retention time 150 c10 years 125 c20 years
am29bds323d 41 preliminary physical dimensions* fdd047 ? 47-pin fine-pitch ball grid array (fbga) 7 x 10 mm package * for reference only. bsc is an ansi standard for basic space centering fdd 047 dwg rev af; 02/00
42 am29bds323d preliminary physical dimensions fdd047 ? 47-pin fine-pitch ball grid array (fbga) 7 x 10 mm (continued)
am29bds323d 43 preliminary revision summary revision a (february 15, 2000) limited, non-public release. revision b (june 20, 2000) public release, with the following changes: block diagram corrected address range to a0 ? a20. ordering information deleted reference to 54 mhz speed option. device bus operations table split address range column into two columns. ac characteristics asynchronous read: in table, changed ? falling ? to ? rising ? in description of t aavds . in diagram, modified t aavds and t aavdh waveforms to reference from the rising edge of avd#. synchronous/burst read table: added t rdys , t ceh specifications. erase/program operations table, program operations timings figure, chip/sector erase operations timings figure: added t avdp . added ps waveforms to program operations timings figure. initial access with power savings (ps) and address boundary latency figure modified d0 data to extended to d1. erase and programming performance added typical and maximum accelerated chip pro- gramming time. revision b+1 (november 27, 2000) accelerated program operation, program command sequence added text indicating that setors must be unlocked prior to raising v pp to v id . chip erase command sequence corrected the command sequence length during unlock bypass mode from four cycles to two. dc characteristics table added specification for active burst mode current with oe# high, i ccb2 . original i ccb specification is now named i ccb1 . ac characteristics figure 9, burst mode read: corrected rdy waveform to indicate behavior when ps is enabled and when rdy is in the high impedance state. figure 14, accelerated unlock bypass programming timing: modified note 3 to indicate that sectors must be unlocked prior to raising v pp to v id . revision b+2 (november 30, 2000) figure 10, asynchronous mode read corrected endpoint for t aavds specification. figure 16, toggle bit timings (during embedded algorithm) corrected oe# waveform during second va (valid address) period. revision b+3 (december 21, 2000) figure 9, burst mode read corrected rdy waveform. revision b+4 (september 4, 2001) global the 90 ns asynchronous access time has been changed to 110 ns. note that the device now has a new ordering part number and a new package marking. sector erase command sequence, dq7: data# polling, and dq6: toggle bit i added explanatory text to indicate 200 s wait for first status read occurring in a different bank than the last sector selected for erasure in a multiple bank sector erase command sequence. table 4, command definitions added extended autoselect device id to table (fifth cycle). added note 9. figure 18, initial access with power saving (ps) function and address boundary latency modified the pulse time rdy is low and in high-z. added note to indicate that rdy exhibits the same behavior when the burst address begins on an address boundary without ps enabled. figure 19, initial access with address boundary latency added figure.
44 am29bds323d preliminary copyright ? 2001 advanced micro devices, inc. all rights reserved. amd, the amd logo, and combinations thereof are registered trademarks of advanced micro devices, inc. product names used in this publication are for identification purposes only and may be trademarks of their respective companies .

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